Description
Product Overview & Description
Brief Summary
Our premium Electronic Grade (E-Glass) Fiberglass Fabric is engineered specifically as a structural reinforcement base for Copper Clad Laminates (CCL) and Printed Circuit Boards (PCB). Woven using advanced air-jet looms, it offers exceptional dimensional stability, high mechanical strength, and superior electrical insulation properties.
Detailed Product Description
Are you looking for a high-reliability reinforcement material to meet the rigorous demands of high-density, multi-layer PCB manufacturing? Our Electronic Grade Fiberglass Fabric provides the structural integrity and thermal endurance your production line requires.
Manufactured from high-purity E-glass formulations, raw materials are drawn into micro-filaments (4–9 µm) and woven with micro-tension precision. Our fabrics strictly adhere to IPC-4412 standards, delivering key technical advantages:
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Superior Dimensional Stability: Precise warp and weft tension control ensures a flat, uniform weave. The fabric maintains minimal deformation under high-temperature lamination, pressing, and etching processes.
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Excellent Electrical Insulation: Serves as the primary dielectric backbone for CCL. Its optimized Dielectric Constant (Dk) and Dissipation Factor (Df) help reduce signal attenuation and loss in high-speed, high-frequency circuit designs.
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High Mechanical Strength & Heat Resistance: Provides robust structural reinforcement, preventing PCB warping and bowing. Excellent thermal resistance makes it fully compatible with lead-free soldering operations.
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Optimum Resin Wet-Out: Treated with specialized silane coupling agents to ensure rapid, uniform epoxy resin impregnation, effectively eliminating internal delamination and white spots (measling).
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High Cleanliness Standards: Produced in cleanroom-monitored environments to guarantee zero oil contamination, loose threads, or conductive impurities.
Applications
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Printed Circuit Board (PCB) Fabrication (Rigid, Multi-layer, and High-Density Interconnect / HDI boards)
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Copper Clad Laminates (CCL) Manufacturing
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Insulation layers for Automotive Electronics, Telecom Gear, Server Motherboards, and Consumer Electronics
Technical Specifications
Note: The values below represent the standard 7628 style. You can adjust these figures if listing 2116, 1080, or custom specifications.
